溴化环氧树脂印刷线路板热分解机理实验研究
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关键词:
- 溴化环氧树脂 /
- 印刷线路板 /
- 热解 /
- 热重-红外联用分析 /
- 热解-气相色谱/质谱联用分析
Abstract: The thermal decomposition of a kind of brominted epoxy resin(BER) printed circuit boards was investigated by using TGFTIR and PyGC/MS. The mechanism of the thermal decomposition of the resin was discussed. The experimental results show that during the thermal decomposition of BER, the brominated parts are firstly decomposed with the splitting of OH—C, O—CH2, C—C (Benzene) bonds, and the pyrolysis products such as CO, acetone, bromomethane, bromophenol and 2,6-dibromophenol are produced. The decomposition of unbrominated parts is conducted at higher temperature with the splitting of OH—C, CH2—O—benzene, C—C(Benzene) bonds, and the pyrolysis products containing phenol, p-isopropylphenol, p-isopropenylacetylphenol, o-ethylphenol and p-methylphenol are made.-
Key words:
- printed circuit boards /
- brominated epoxy resin /
- thermal decomposition /
- TG-FTIR /
- Py-GC/MS
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